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The influence of barrier slurry selectivity on the design window for copper CMP

dc.contributor.authorKim, Hoyouny
dc.contributor.authorVaes, Jan
dc.contributor.authorLi, Yunlong
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-17T07:59:23Z
dc.date.available2021-10-17T07:59:23Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13949
dc.sourceIIOimport
dc.titleThe influence of barrier slurry selectivity on the design window for copper CMP
dc.typeProceedings paper
dc.contributor.imecauthorLi, Yunlong
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology
dc.source.conferencedate10/11/2008
dc.source.conferencelocationTaipei Taiwan
imec.availabilityPublished - imec


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