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Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking

dc.contributor.authorLabie, Riet
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorBaert, Kris
dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-17T08:05:33Z
dc.date.available2021-10-17T08:05:33Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13971
dc.sourceIIOimport
dc.titleResistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage19
dc.source.endpage21
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC
dc.source.conferencedate1/06/2008
dc.source.conferencelocationSan Fransisco, CA US
imec.availabilityPublished - imec


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