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dc.contributor.authorLambrinou, Konstantza
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-17T08:08:38Z
dc.date.available2021-10-17T08:08:38Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13983
dc.sourceIIOimport
dc.titleStudy of the mechanism of bulk embrittlement of Sn-based Pb-free solders
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceEuropean Electronics Assembly Reliability Summit
dc.source.conferencedate22/10/2008
dc.source.conferencelocationTallinn Estonia
imec.availabilityPublished - open access


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