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Will 3D stacking of ICs enable to continue Moore's momentum in the 21st century?

dc.contributor.authorLauwereins, Rudy
dc.date.accessioned2021-10-17T08:11:14Z
dc.date.available2021-10-17T08:11:14Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13993
dc.sourceIIOimport
dc.titleWill 3D stacking of ICs enable to continue Moore's momentum in the 21st century?
dc.typeOral presentation
dc.contributor.imecauthorLauwereins, Rudy
dc.contributor.orcidimecLauwereins, Rudy::0000-0002-3861-0168
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference8th International Forum on Application-Specific SoC - MPSoC
dc.source.conferencedate23/06/2008
dc.source.conferencelocationValkenburg Netherlands
imec.availabilityPublished - open access


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