Show simple item record

Improving the copper electroplating process for 3D-stacked integrated circuits

dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVereecken, Philippe
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-17T08:34:38Z
dc.date.available2021-10-17T08:34:38Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14074
dc.sourceIIOimport
dc.titleImproving the copper electroplating process for 3D-stacked integrated circuits
dc.typeJournal article
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.beginpage26
dc.source.endpage28
dc.source.journalSemiconductor Manufacturing China
dc.source.volume5
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record