Improving the copper electroplating process for 3D-stacked integrated circuits

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Authors

Luhn, Ole; Radisic, Alex; Ruythooren, Wouter; Vereecken, Philippe; Celis, Jean-Pierre; Van Hoof, Chris; Swinnen, Bart

Journal

Semiconductor Manufacturing China

Volume

5

Title

Improving the copper electroplating process for 3D-stacked integrated circuits

Publication type

Journal article

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