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Reducing the electrodeposition time for filling microvias with copper for 3D technology

dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-17T08:34:57Z
dc.date.available2021-10-17T08:34:57Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14075
dc.sourceIIOimport
dc.titleReducing the electrodeposition time for filling microvias with copper for 3D technology
dc.typeProceedings paper
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage866
dc.source.endpage870
dc.source.conference58th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - open access


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