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Two component additive plating for through silicon via fillings

dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorSwinnen, Bart
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-17T08:35:15Z
dc.date.available2021-10-17T08:35:15Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14076
dc.sourceIIOimport
dc.titleTwo component additive plating for through silicon via fillings
dc.typeMeeting abstract
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference - AMC
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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