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Metallization of 3D via structures in silicon for interconnect technology

dc.contributor.authorLuhn, Ole
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-17T08:35:48Z
dc.date.available2021-10-17T08:35:48Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14078
dc.sourceIIOimport
dc.titleMetallization of 3D via structures in silicon for interconnect technology
dc.typeMeeting abstract
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.source.peerreviewno
dc.source.beginpage39
dc.source.endpage40
dc.source.conference17th Workshop Materials for Advanced Metallization
dc.source.conferencedate2/03/2008
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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