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Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses

dc.contributor.authorLuhn, Ole
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-17T08:36:06Z
dc.date.available2021-10-17T08:36:06Z
dc.date.issued2008
dc.identifier.issn0167-9317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14079
dc.sourceIIOimport
dc.titleBarrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD proecesses
dc.typeJournal article
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1947
dc.source.endpage1951
dc.source.journalMicroelectronic Engineering
dc.source.issue10
dc.source.volume85
imec.availabilityPublished - open access
imec.internalnotesPaper from 'Materials for Advanced Metallization 2008'


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