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Engineering self assembled monolayer as copper diffusion barrier: Cu/NH2-SAM/SiO2 interface characterization

dc.contributor.authorMaestre Caro, Arantxa
dc.date.accessioned2021-10-17T08:40:25Z
dc.date.available2021-10-17T08:40:25Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14094
dc.sourceIIOimport
dc.titleEngineering self assembled monolayer as copper diffusion barrier: Cu/NH2-SAM/SiO2 interface characterization
dc.typeMeeting abstract
dc.source.peerreviewno
dc.source.conferenceInternational symposium of surface science and nanotechnology - ISSS-5
dc.source.conferencedate9/11/2008
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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