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Establishing solder interconnects in capillary die-to-substrate self-assembly

dc.contributor.authorMastrangeli, Massimo
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-17T08:53:09Z
dc.date.available2021-10-17T08:53:09Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14137
dc.sourceIIOimport
dc.titleEstablishing solder interconnects in capillary die-to-substrate self-assembly
dc.typeProceedings paper
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVan Hoof, Chris
dc.source.peerreviewyes
dc.source.beginpage45
dc.source.endpage55
dc.source.conference3D System Integration Conference - 3D-SIC
dc.source.conferencedate12/05/2008
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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