Characterization of interconnects resulting from capillary die-to-substrate self-assembly
dc.contributor.author | Mastrangeli, Massimo | |
dc.contributor.author | Ruythooren, Wouter | |
dc.contributor.author | Van Hoof, Chris | |
dc.contributor.author | Celis, Jean-Pierre | |
dc.date.accessioned | 2021-10-17T08:53:26Z | |
dc.date.available | 2021-10-17T08:53:26Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14138 | |
dc.source | IIOimport | |
dc.title | Characterization of interconnects resulting from capillary die-to-substrate self-assembly | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Ruythooren, Wouter | |
dc.contributor.imecauthor | Van Hoof, Chris | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 135 | |
dc.source.endpage | 140 | |
dc.source.conference | 2nd Electronics System-Integration Technology Conference - ESTC | |
dc.source.conferencedate | 1/09/2008 | |
dc.source.conferencelocation | Greenwich UK | |
imec.availability | Published - open access |