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dc.contributor.authorMertens, Paul
dc.contributor.authorVos, Rita
dc.contributor.authorVereecke, Guy
dc.contributor.authorJanssens, Tom
dc.contributor.authorWostyn, Kurt
dc.contributor.authorClaes, Martine
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHalder, Sandip
dc.contributor.authorHoyer, Ronald
dc.contributor.authorAndreas, Michael
dc.contributor.authorKim, Kyung Hyun
dc.contributor.authorBarbagini, Francesca
dc.contributor.authorZijlstra, Aaldert
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorKim, Tae-Gon
dc.contributor.authorKenis, Karine
dc.contributor.authorArnauts, Sophia
dc.contributor.authorLux, Marcel
dc.contributor.authorBearda, Twan
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-17T09:00:23Z
dc.date.available2021-10-17T09:00:23Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14159
dc.sourceIIOimport
dc.titleRoadblocks and critical aspects for sub 45 nm wafer cleaning and possible solutions
dc.typeProceedings paper
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorArnauts, Sophia
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecVos, Rita::0000-0003-2610-3406
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage436
dc.source.endpage446
dc.source.conference7th International Semiconductor Technology Conference - ISTC
dc.source.conferencedate15/03/2008
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


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