K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries
dc.contributor.author | Nagar, Magi | |
dc.contributor.author | Vaes, Jan | |
dc.contributor.author | Ein Eli, Yair | |
dc.date.accessioned | 2021-10-17T09:16:01Z | |
dc.date.available | 2021-10-17T09:16:01Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14210 | |
dc.source | IIOimport | |
dc.title | K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries | |
dc.type | Oral presentation | |
dc.source.peerreview | no | |
dc.source.conference | 7th International Symposium on Electrochemical Micro & Nano-system Technologies - EMNT | |
dc.source.conferencedate | 15/09/2008 | |
dc.source.conferencelocation | Ein-Gedi Israel | |
imec.availability | Published - imec |
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