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Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM

dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorJourdain, Anne
dc.contributor.authorVandevelde, Bart
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVandepitte, Dirk
dc.date.accessioned2021-10-17T09:28:34Z
dc.date.available2021-10-17T09:28:34Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14248
dc.sourceIIOimport
dc.titleAssessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.conferenceEuroSimE: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
dc.source.conferencedate20/04/2008
dc.source.conferencelocationFreiburg Germany
imec.availabilityPublished - imec


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