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Electrochemical nucleation and growth of copper on resistive substrates

dc.contributor.authorRadisic, Alex
dc.contributor.authorBoelen, Pieter
dc.contributor.authorRosenfeld, Aron
dc.contributor.authorHernandez, Jose Luis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-17T10:02:21Z
dc.date.available2021-10-17T10:02:21Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14349
dc.sourceIIOimport
dc.titleElectrochemical nucleation and growth of copper on resistive substrates
dc.typeProceedings paper
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.beginpage25
dc.source.endpage33
dc.source.conferenceElectrodeposition of Nanoengineered Materials and Alloys 2
dc.source.conferencedate7/10/2007
dc.source.conferencelocationWashington, DC USA
dc.identifier.urlhttp://ecsdl.aip.org/vsearch/servlet/VerityServlet?KEY=ECSTF8&smode=strresults&CURRENT=&ONLINE=&SMODE=&ver=&sti=&arttype=&pjourn
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 11, Issue 28


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