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Hybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bonding

dc.contributor.authorStankovic, Stevan
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.date.accessioned2021-10-17T10:59:35Z
dc.date.available2021-10-17T10:59:35Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14510
dc.sourceIIOimport
dc.titleHybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bonding
dc.typeOral presentation
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceePIXnetSpring School '08, Technology for Photonics Integration
dc.source.conferencedate11/05/2008
dc.source.conferencelocationElba Italy
imec.availabilityPublished - open access
imec.internalnotes74 - poster nr. 42


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