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The 3rd dimension: semiconductor technology and design for tomorrow's 3-D integrated products

dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-17T11:06:01Z
dc.date.available2021-10-17T11:06:01Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14528
dc.sourceIIOimport
dc.titleThe 3rd dimension: semiconductor technology and design for tomorrow's 3-D integrated products
dc.typeProceedings paper
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecSwinnen, Bart::0000-0002-6878-7124
dc.source.peerreviewno
dc.source.conference3-D Architectures for Semiconductor Integration and Packaging
dc.source.conferencedate17/11/2008
dc.source.conferencelocationSan Francisco, CA California
imec.availabilityPublished - imec


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