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Wafer thinning and planarization tech-nology for 3D Interconnects

dc.contributor.authorVaes, Jan
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-17T11:29:35Z
dc.date.available2021-10-17T11:29:35Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14591
dc.sourceIIOimport
dc.titleWafer thinning and planarization tech-nology for 3D Interconnects
dc.typeProceedings paper
dc.contributor.imecauthorSwinnen, Bart
dc.source.peerreviewno
dc.source.conference13th International C.M.P. Planarization for ULSI Multilevel Interconnection Conference - CMP-MIC
dc.source.conferencedate3/03/2008
dc.source.conferencelocationFremont, CA USA
imec.availabilityPublished - imec


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