Show simple item record

Process technology for the fabrication of a chip-in-wire style packaging

dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorIker, Francois
dc.contributor.authorDe Preter, Inge
dc.contributor.authorMuller, Philippe
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBaert, Kris
dc.date.accessioned2021-10-17T12:07:59Z
dc.date.available2021-10-17T12:07:59Z
dc.date.issued2008-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14692
dc.sourceIIOimport
dc.titleProcess technology for the fabrication of a chip-in-wire style packaging
dc.typeProceedings paper
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorMuller, Philippe
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage303
dc.source.endpage308
dc.source.conference58th Electronic Components abd Technology Conference - ECTC
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, FL USA
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
15027.pdf
Size:
2.865Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record