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High throughput measurement techniques for wafer level yield inspection of MEMS devices

dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLauwagie, Tom
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorHaspeslagh, Luc
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-17T12:21:26Z
dc.date.available2021-10-17T12:21:26Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14726
dc.sourceIIOimport
dc.titleHigh throughput measurement techniques for wafer level yield inspection of MEMS devices
dc.typeProceedings paper
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorHaspeslagh, Luc
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage71550M
dc.source.conference9th International Symposium on Laser Metrology
dc.source.conferencedate30/06/2008
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 7155


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