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High-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures

dc.contributor.authorSercu, Stefaan
dc.contributor.authorMartens, Luc
dc.date.accessioned2021-09-29T15:24:10Z
dc.date.available2021-09-29T15:24:10Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1474
dc.sourceIIOimport
dc.titleHigh-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures
dc.typeProceedings paper
dc.contributor.imecauthorMartens, Luc
dc.source.peerreviewno
dc.source.beginpage67
dc.source.endpage70
dc.source.conferenceElectrical Performance of Electronic Packaging; 28-30 October 1996; Napa, CA, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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