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Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

dc.contributor.authorYang, Yu
dc.contributor.authorBender, Hugo
dc.contributor.authorArstila, Kai
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVerlinden, Bert
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-17T12:57:25Z
dc.date.available2021-10-17T12:57:25Z
dc.date.issued2008
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14811
dc.sourceIIOimport
dc.titleDetection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures
dc.typeJournal article
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage1517
dc.source.endpage1520
dc.source.journalMicroelectronics Reliability
dc.source.issue8_9
dc.source.volume48
dc.identifier.urlhttp://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6V47-4T2S02Y-5&_user=799533&_rdoc=1&_fmt=&_orig=search&_sort=d&view=c&
imec.availabilityPublished - imec
imec.internalnotesESREF 2008


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