dc.contributor.author | Yang, Yu | |
dc.contributor.author | De Munck, Koen | |
dc.contributor.author | Cotrin Teixeira, Ricardo | |
dc.contributor.author | Swinnen, Bart | |
dc.contributor.author | Verlinden, Bert | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2021-10-17T12:57:50Z | |
dc.date.available | 2021-10-17T12:57:50Z | |
dc.date.issued | 2008-07 | |
dc.identifier.issn | 0268-1242 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14812 | |
dc.source | IIOimport | |
dc.title | Process induced sub-surface damage in mechanically ground silicon wafers | |
dc.type | Journal article | |
dc.contributor.imecauthor | De Munck, Koen | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 75038 | |
dc.source.journal | Semiconductor Science and Technology | |
dc.source.issue | 7 | |
dc.source.volume | 23 | |
dc.identifier.url | http://iopscience.iop.org/0268-1242/23/7/075038/ | |
imec.availability | Published - open access | |