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Process induced sub-surface damage in mechanically ground silicon wafers

dc.contributor.authorYang, Yu
dc.contributor.authorDe Munck, Koen
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVerlinden, Bert
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-17T12:57:50Z
dc.date.available2021-10-17T12:57:50Z
dc.date.issued2008-07
dc.identifier.issn0268-1242
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14812
dc.sourceIIOimport
dc.titleProcess induced sub-surface damage in mechanically ground silicon wafers
dc.typeJournal article
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage75038
dc.source.journalSemiconductor Science and Technology
dc.source.issue7
dc.source.volume23
dc.identifier.urlhttp://iopscience.iop.org/0268-1242/23/7/075038/
imec.availabilityPublished - open access


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