Process induced sub-surface damage in mechanically ground silicon wafers

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Authors

Yang, Yu; De Munck, Koen; Cotrin Teixeira, Ricardo; Swinnen, Bart; Verlinden, Bert; De Wolf, Ingrid

ISSN

0268-1242

Issue

7

Journal

Semiconductor Science and Technology

Volume

23

Title

Process induced sub-surface damage in mechanically ground silicon wafers

Publication type

Journal article

Embargo date

9999-12-31

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