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Optimizing Au and In micro-bumping for 3D chip stacking

dc.contributor.authorZhang, Wenqi
dc.contributor.authorMatin, Abdul
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T13:07:36Z
dc.date.available2021-10-17T13:07:36Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14835
dc.sourceIIOimport
dc.titleOptimizing Au and In micro-bumping for 3D chip stacking
dc.typeProceedings paper
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1984
dc.source.endpage1989
dc.source.conference58th Electronic Components and Technology Conference
dc.source.conferencedate27/05/2008
dc.source.conferencelocationLake Buena Vista, Florida USA
imec.availabilityPublished - open access


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