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Diamond bit cutting for processing high topography wafers

dc.contributor.authorAgarwal, Rahul
dc.contributor.authorPham, Nga
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorAndrei, Alexandru
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorIker, Francois
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-17T21:17:22Z
dc.date.available2021-10-17T21:17:22Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14882
dc.sourceIIOimport
dc.titleDiamond bit cutting for processing high topography wafers
dc.typeProceedings paper
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorAndrei, Alexandru
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.conference11th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate9/12/1990
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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