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Low temperature direct Cu-Cu immersion bonding for 3D integration

dc.contributor.authorAgarwal, Rahul
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-17T21:17:23Z
dc.date.available2021-10-17T21:17:23Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14883
dc.sourceIIOimport
dc.titleLow temperature direct Cu-Cu immersion bonding for 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorRuythooren, Wouter
dc.source.peerreviewno
dc.source.beginpageD08-02-F06-02
dc.source.conferenceMaterials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics
dc.source.conferencedate13/04/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Symposium Proceedings; Vol. 1156


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