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High density Cu-Sn TLP bonding for 3D integration

dc.contributor.authorAgarwal, Rahul
dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-17T21:17:24Z
dc.date.available2021-10-17T21:17:24Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14884
dc.sourceIIOimport
dc.titleHigh density Cu-Sn TLP bonding for 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorRuythooren, Wouter
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage345
dc.source.endpage349
dc.source.conference59th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate26/05/2009
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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