Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package
dc.contributor.author | Andersson, Cristina | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Noritake, Chikage | |
dc.contributor.author | Sun, P | |
dc.contributor.author | Tegehall, Per-Erik | |
dc.contributor.author | Andersson, Dag | |
dc.contributor.author | Wetter, G | |
dc.contributor.author | Liu, Johan | |
dc.date.accessioned | 2021-10-17T21:17:51Z | |
dc.date.available | 2021-10-17T21:17:51Z | |
dc.date.issued | 2009 | |
dc.identifier.issn | 0954-0911 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14900 | |
dc.source | IIOimport | |
dc.title | Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 28 | |
dc.source.endpage | 38 | |
dc.source.journal | Soldering & Surface Mount Technology | |
dc.source.issue | 2 | |
dc.source.volume | 21 | |
imec.availability | Published - imec |
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