Show simple item record

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package

dc.contributor.authorAndersson, Cristina
dc.contributor.authorVandevelde, Bart
dc.contributor.authorNoritake, Chikage
dc.contributor.authorSun, P
dc.contributor.authorTegehall, Per-Erik
dc.contributor.authorAndersson, Dag
dc.contributor.authorWetter, G
dc.contributor.authorLiu, Johan
dc.date.accessioned2021-10-17T21:17:51Z
dc.date.available2021-10-17T21:17:51Z
dc.date.issued2009
dc.identifier.issn0954-0911
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14900
dc.sourceIIOimport
dc.titleThermal cycling of lead-free Sn-3.8Ag-0.7Cu 388 PBGA package
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage28
dc.source.endpage38
dc.source.journalSoldering & Surface Mount Technology
dc.source.issue2
dc.source.volume21
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record