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Electroless Cu deposition on self-assembled monolayer alternative barriers

dc.contributor.authorArmini, Silvia
dc.contributor.authorMaestre Caro, Arantxa
dc.date.accessioned2021-10-17T21:18:06Z
dc.date.available2021-10-17T21:18:06Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14907
dc.sourceIIOimport
dc.titleElectroless Cu deposition on self-assembled monolayer alternative barriers
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewno
dc.source.beginpage1156-D04-08
dc.source.conferenceMaterials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics
dc.source.conferencedate13/04/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMRS Meeting Symposium Proceedings; Vol. 1156


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