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Physicochemical mechanism of damascene copper plating: effect of suppressor

dc.contributor.authorAtanasova, Tanya
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-17T21:18:29Z
dc.date.available2021-10-17T21:18:29Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14917
dc.sourceIIOimport
dc.titlePhysicochemical mechanism of damascene copper plating: effect of suppressor
dc.typeMeeting abstract
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2708
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
dc.identifier.urlhttp://ecsmeet6.peerx-press.org/jsp/mas/reportSymposiumList.jsp
imec.availabilityPublished - open access
imec.internalnotesMeeting Abstracts; Vol. 2009-02


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