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3D system integration and interconnect hierarchy: definitions and technology trends

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T21:22:58Z
dc.date.available2021-10-17T21:22:58Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14987
dc.sourceIIOimport
dc.title3D system integration and interconnect hierarchy: definitions and technology trends
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceSEMI KGD Packaging & Test Workshop
dc.source.conferencedate1/10/2009
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - open access


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