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3D integration technology and the microelectronics supply chain: barriers and solutions

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T21:23:15Z
dc.date.available2021-10-17T21:23:15Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14991
dc.sourceIIOimport
dc.title3D integration technology and the microelectronics supply chain: barriers and solutions
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceIMAPS Global Business Council, Spring Conference
dc.source.conferencedate8/03/2009
dc.source.conferencelocationScottsdale, AZ USA
imec.availabilityPublished - open access


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