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3D system integration using through-Si via technologies. Definitions, roadmaps, technical challenges and solutions to economical barriers

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T21:23:19Z
dc.date.available2021-10-17T21:23:19Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14992
dc.sourceIIOimport
dc.title3D system integration using through-Si via technologies. Definitions, roadmaps, technical challenges and solutions to economical barriers
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference4th IMPACT Conference & International 3D IC Conference
dc.source.conferencedate21/10/2009
dc.source.conferencelocationTaipei Taiwan
imec.availabilityPublished - open access
imec.internalnotesInvited (Outstanding Lecturer Award)


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