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Chips with extra functionality: Combining MEMS and smart packaging

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T21:23:27Z
dc.date.available2021-10-17T21:23:27Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14994
dc.sourceIIOimport
dc.titleChips with extra functionality: Combining MEMS and smart packaging
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference10th IMEC Executive Seminar
dc.source.conferencedate9/11/2009
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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