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Advanced technologies for in-line and post-processed TSV integration

dc.contributor.authorBeyne, Eric
dc.contributor.authorSwinnen, Bart
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-17T21:23:32Z
dc.date.available2021-10-17T21:23:32Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14995
dc.sourceIIOimport
dc.titleAdvanced technologies for in-line and post-processed TSV integration
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage695
dc.source.endpage700
dc.source.conferenceInternational Semiconductor Technology Conference - ISTC/CSTIC
dc.source.conferencedate19/03/2009
dc.source.conferencelocationShanghai China
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 18, issue 1


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