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Phase behavior through pitch and duty cycle and its impact on process window

dc.contributor.authorButtgereit, Ute
dc.contributor.authorBirkner, Robert
dc.contributor.authorSeidel, Dirk
dc.contributor.authorPerlitz, Sacha
dc.contributor.authorPhilipsen, Vicky
dc.contributor.authorDe Bisschop, Peter
dc.date.accessioned2021-10-17T21:30:04Z
dc.date.available2021-10-17T21:30:04Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15058
dc.sourceIIOimport
dc.titlePhase behavior through pitch and duty cycle and its impact on process window
dc.typeProceedings paper
dc.contributor.imecauthorPhilipsen, Vicky
dc.contributor.imecauthorDe Bisschop, Peter
dc.contributor.orcidimecPhilipsen, Vicky::0000-0002-2959-432X
dc.source.peerreviewno
dc.source.beginpage737916
dc.source.conferencePhotomask and Next-Generation Lithography Mask Technology XVI
dc.source.conferencedate8/04/2009
dc.source.conferencelocationYokohama Japan
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 7379


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