dc.contributor.author | Carbonell, Laure | |
dc.contributor.author | Volders, Henny | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Kellens, Kristof | |
dc.contributor.author | Caluwaerts, Rudy | |
dc.contributor.author | Devriendt, Katia | |
dc.contributor.author | Altamirano Sanchez, Efrain | |
dc.contributor.author | Wouters, Johan M. D. | |
dc.contributor.author | Gravey, Virginie | |
dc.contributor.author | Shah, Kavita | |
dc.contributor.author | Luo, Qian | |
dc.contributor.author | Sundarrajan, Arvind | |
dc.contributor.author | Lu, Jiang | |
dc.contributor.author | Aubuchon, Joseph | |
dc.contributor.author | Ma, Paul | |
dc.contributor.author | Narasimhan, Murali | |
dc.contributor.author | Cockburn, Andrew | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-17T21:30:47Z | |
dc.date.available | 2021-10-17T21:30:47Z | |
dc.date.issued | 2009 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15063 | |
dc.source | IIOimport | |
dc.title | Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Volders, Henny | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Kellens, Kristof | |
dc.contributor.imecauthor | Caluwaerts, Rudy | |
dc.contributor.imecauthor | Devriendt, Katia | |
dc.contributor.imecauthor | Altamirano Sanchez, Efrain | |
dc.contributor.imecauthor | Wouters, Johan M. D. | |
dc.contributor.imecauthor | Cockburn, Andrew | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.orcidimec | Devriendt, Katia::0000-0002-0662-7926 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 200 | |
dc.source.endpage | 202 | |
dc.source.conference | Proceedings of the IEEE International Interconnect Technology Conference | |
dc.source.conferencedate | 1/06/2009 | |
dc.source.conferencelocation | Sapporo Japan | |
imec.availability | Published - imec | |