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dc.contributor.authorChiodarelli, Nicolo
dc.contributor.authorKellens, Kristof
dc.contributor.authorCott, Daire
dc.contributor.authorPeys, Nick
dc.contributor.authorArstila, Kai
dc.contributor.authorHeyns, Marc
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-17T21:34:59Z
dc.date.available2021-10-17T21:34:59Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15093
dc.sourceIIOimport
dc.titleIntegration of vertical carbon nanotube bundles for interconnects
dc.typeProceedings paper
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorCott, Daire
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage11
dc.source.endpage24
dc.source.conferenceElectrochemical Processing in ULSI and MEMS 4
dc.source.conferencedate24/05/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 19, issue 24


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