dc.contributor.author | Chiodarelli, Nicolo | |
dc.contributor.author | Kellens, Kristof | |
dc.contributor.author | Cott, Daire | |
dc.contributor.author | Peys, Nick | |
dc.contributor.author | Arstila, Kai | |
dc.contributor.author | Heyns, Marc | |
dc.contributor.author | De Gendt, Stefan | |
dc.contributor.author | Groeseneken, Guido | |
dc.contributor.author | Vereecken, Philippe | |
dc.date.accessioned | 2021-10-17T21:34:59Z | |
dc.date.available | 2021-10-17T21:34:59Z | |
dc.date.issued | 2009 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15093 | |
dc.source | IIOimport | |
dc.title | Integration of vertical carbon nanotube bundles for interconnects | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Kellens, Kristof | |
dc.contributor.imecauthor | Cott, Daire | |
dc.contributor.imecauthor | Heyns, Marc | |
dc.contributor.imecauthor | De Gendt, Stefan | |
dc.contributor.imecauthor | Groeseneken, Guido | |
dc.contributor.imecauthor | Vereecken, Philippe | |
dc.contributor.orcidimec | De Gendt, Stefan::0000-0003-3775-3578 | |
dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 11 | |
dc.source.endpage | 24 | |
dc.source.conference | Electrochemical Processing in ULSI and MEMS 4 | |
dc.source.conferencedate | 24/05/2009 | |
dc.source.conferencelocation | San Francisco, CA USA | |
imec.availability | Published - open access | |
imec.internalnotes | ECS Transactions; Vol. 19, issue 24 | |