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3D integration of ultra-thin functional devices inside standard multilayer flex laminates

dc.contributor.authorChristiaens, Wim
dc.contributor.authorTorfs, Tom
dc.contributor.authorHuwel, W.
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-17T21:35:22Z
dc.date.available2021-10-17T21:35:22Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15096
dc.sourceIIOimport
dc.title3D integration of ultra-thin functional devices inside standard multilayer flex laminates
dc.typeProceedings paper
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference17th European Microelectronics and Packaging Conference & Exhibition - EMPC
dc.source.conferencedate15/06/2009
dc.source.conferencelocationRimini Italy
imec.availabilityPublished - open access


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