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Time and temperature dependence of early stages of stress-induced-voiding in Cu/low-k interconnects

dc.contributor.authorCroes, Kristof
dc.contributor.authorWilson, Chris
dc.contributor.authorLofrano, Melina
dc.contributor.authorTravaly, Youssef
dc.contributor.authorDe Roest, David
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-17T21:41:38Z
dc.date.available2021-10-17T21:41:38Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15139
dc.sourceIIOimport
dc.titleTime and temperature dependence of early stages of stress-induced-voiding in Cu/low-k interconnects
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewno
dc.source.beginpage457
dc.source.endpage463
dc.source.conference47th Annual IEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate26/04/2009
dc.source.conferencelocationMontreal Canada
imec.availabilityPublished - imec


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