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Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route

dc.contributor.authorDe Roest, David
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeynet, Julien
dc.contributor.authorSprey, Hessel
dc.contributor.authorLabat, Julianne
dc.contributor.authorHuffman, Craig
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorKaneko, S.
dc.contributor.authorMatsushita, K.
dc.contributor.authorKobayashi, N.
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-17T21:48:06Z
dc.date.available2021-10-17T21:48:06Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15179
dc.sourceIIOimport
dc.titleVariation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route
dc.typeMeeting abstract
dc.contributor.imecauthorDe Roest, David
dc.contributor.imecauthorSprey, Hessel
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.source.peerreviewno
dc.source.conference18th Workshop Materials for Advanced Metallization - MAM
dc.source.conferencedate8/03/2009
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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