Can reversible electronics avoid thermal problems?
| dc.contributor.author | De Vos, Alexis | |
| dc.date.accessioned | 2021-10-17T21:48:52Z | |
| dc.date.available | 2021-10-17T21:48:52Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15183 | |
| dc.source | IIOimport | |
| dc.title | Can reversible electronics avoid thermal problems? | |
| dc.type | Proceedings paper | |
| dc.date.embargo | 9999-12-31 | |
| dc.source.peerreview | no | |
| dc.source.conference | 8th International Conference on Microtechnology and Thermal Problems in Electronics | |
| dc.source.conferencedate | 28/06/2009 | |
| dc.source.conferencelocation | Lodz Poland | |
| imec.availability | Published - open access |