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Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions

dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorMertens, Paul
dc.contributor.authorSchmidt, Harald
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-09-29T15:31:06Z
dc.date.available2021-09-29T15:31:06Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1525
dc.sourceIIOimport
dc.titleImpact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions
dc.typeJournal article
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage3323
dc.source.endpage3327
dc.source.journalJournal of the Electrochemical Society
dc.source.issue10
dc.source.volume143
imec.availabilityPublished - open access


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