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Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions

dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorSchmidt, Harald
dc.contributor.authorRotondaro, Antonio
dc.contributor.authorHurd, Trace
dc.contributor.authorMouche, Laurent
dc.contributor.authorMertens, Paul
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.contributor.authorVanhaeren, Danielle
dc.contributor.authorVandervorst, Wilfried
dc.date.accessioned2021-09-29T15:31:45Z
dc.date.available2021-09-29T15:31:45Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1529
dc.sourceIIOimport
dc.titleImpact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions
dc.typeProceedings paper
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorVanhaeren, Danielle
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.contributor.orcidimecVanhaeren, Danielle::0000-0001-8624-9533
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage284
dc.source.endpage291
dc.source.conferenceProceedings of the Fourth International Symposium on Cleaning technology in Semiconductor Device Manufacturing
dc.source.conferencedate9/10/1995
dc.source.conferencelocationChicago, IL USA
imec.availabilityPublished - open access
imec.internalnotesECS Proceedings; Vol. 95-20


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