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CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment

dc.contributor.authorGalan, V.J.
dc.contributor.authorSanchis, P.
dc.contributor.authorMarti, J.
dc.contributor.authorMarx, S.
dc.contributor.authorSchröder, H.
dc.contributor.authorMurhopadhyay, B.
dc.contributor.authorTekin, T.
dc.contributor.authorSelvaraja, Shankar
dc.contributor.authorBogaerts, Wim
dc.contributor.authorDumon, Pieter
dc.contributor.authorZimmerman, L.
dc.date.accessioned2021-10-17T22:17:18Z
dc.date.available2021-10-17T22:17:18Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15325
dc.sourceIIOimport
dc.titleCMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment
dc.typeProceedings paper
dc.contributor.imecauthorBogaerts, Wim
dc.contributor.orcidimecBogaerts, Wim::0000-0003-1112-8950
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage148
dc.source.endpage150
dc.source.conference6th IEEE International Conference on Group IV Photonics
dc.source.conferencedate9/09/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotespaper ThP13


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