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Ultra-thin chip packaging (UTCP): a promising technology for future flexible display interconnection

dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorChristiaens, Wim
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-17T22:30:32Z
dc.date.available2021-10-17T22:30:32Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15383
dc.sourceIIOimport
dc.titleUltra-thin chip packaging (UTCP): a promising technology for future flexible display interconnection
dc.typeProceedings paper
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage202
dc.source.endpage205
dc.source.conferenceSID DIGEST
dc.source.conferencedate31/05/2009
dc.source.conferencelocationSan Antonio, TX USA
imec.availabilityPublished - open access


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