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Damage cluster analysis of patterned wafers during solvent spray cleaning

dc.contributor.authorHalder, Sandip
dc.contributor.authorWostyn, Kurt
dc.contributor.authorAndreas, Michael
dc.contributor.authorWada, Masayuki
dc.contributor.authorBrems, Steven
dc.contributor.authorBearda, Twan
dc.contributor.authorPacco, Antoine
dc.contributor.authorKenis, Karine
dc.contributor.authorMertens, Paul
dc.contributor.authorVos, Rita
dc.date.accessioned2021-10-17T22:40:37Z
dc.date.available2021-10-17T22:40:37Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15425
dc.sourceIIOimport
dc.titleDamage cluster analysis of patterned wafers during solvent spray cleaning
dc.typeMeeting abstract
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorVos, Rita
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.source.peerreviewno
dc.source.beginpage2081
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - imec
imec.internalnotesMeeting Abstracts; Vol. MA2009-02


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